These transceivers are compatible with the Compact Small Form- Factor Pluggable (CSFP) Multi-Source Agreement (MSA) option 2, The transceiver consists of 2-channel Bi-directional Optical Transceiver unit with five sections: the LD driver, the limiting amplifier, the digital diagnostic monitor, the 1310nm FP laser (the 1490nm DFB laser) and the PIN photo-detector .The module data link up to 10km in 9/125um single mode fiber. The optical output can be disabled by a TTL logic high-level input of Tx Disable, and the system also can disable the module via I2C. Tx Fault is provided to indicate that degradation of the laser. Loss of signal (LOS) output is provided to indicate the loss of an input optical signal of receiver or the link status with partner. The system can also get the LOS (or Link)/Disable/Fault information via I2C register access. Conventional SFP will function when plugged into a C-SFP socket, at the same time no damage to C-SFP and host board if C-SFP module is plugged into a conventional SFP socket.

CSFP 1000Base BiDi LR/LW

57,20$Price
Wavelength (nm)
Temperature Range
  • • 1250Mbps Typical Data Rate and compliant to 1000Base BX10 IEEE802.3ah
    • 1490nm DFB laser transmitter
    • PIN photo-detector
    • Up to 10km on 9/125um SMF
    • Hot-pluggable CSFP footprint
    • LC/UPC type pluggable optical interface
    • Achieve operational compatibility with conventional SFP
    • Metal enclosure, for lower EMI
    • RoHS compliant and lead-free
    • Single +3.3V power supply
    • Support Digital Diagnostic Monitoring interface
    • Compliant with SFF-8472
    • Case operating temperature: 0C to +70C or -40C to +85C

  • • Gigabit Ethernet(1000BASE-BX10)
    • Point to Point FTTH Application
    • Switched Backplane Applications
    • Router/Server Interface
    • Switch to Switch Interface
    • Other Optical Links

Customer Service

PICadvanced is a company located in Aveiro. Specialized in solving complex problems through optics, namely through optical chip design, development and packaging.
We develop and consult processes and solutions on optics using integrated packaging and integration on electrotechnology, telecommunications and biomedicine products.

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